TSMC’s Japanese subsidiary, JASM, has signed a contract with the government of Kikuyō Town in Kumamoto Prefecture to build its second wafer fabrication plant, which marks the start of construction. The new plant involves a total investment of around $13.9 billion and will focus on 6-nanometer chips for cutting-edge applications such as autonomous driving and artificial intelligence, with production expected to begin by the end of 2027. The second plant is located east of the first plant, covering 69,000 square meters, and will create 1,700 new jobs. Together with the first plant, the two fabs will employ more than 3,400 people. The Japanese government is providing a subsidy of 1.2 trillion yen ($7.8 billion) for the two plants to support the domestic semiconductor industry. This project will upgrade Japan’s chip technology from 28 nanometers directly to 6 nanometers. [Icsmart, in Chinese]
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