Xiaomi’s second-generation in-house flagship mobile processor, Xring O2, will be manufactured using TSMC’s 3-nanometre N3P process, rather than the foundry’s latest 2-nanometre technology, according to industry analysts. The decision to forgo the 2-nanometre node is widely seen as driven by cost considerations and production capacity constraints, the analysts said. Xiaomi launched its first self-developed flagship processor, Xring O1, in early 2025. The chip was produced using TSMC’s N3E process, making it the first 3nm flagship mobile processor independently designed by a Chinese company.
If Xring O2 is released in the first half of this year, it is expected to be used in Xiaomi’s flagship smartphones launched during the same period. Analysts noted that 2nm flagship chips from Apple, Qualcomm and MediaTek are not expected to enter the market until around September, allowing Xiaomi to maintain a process-node advantage in the first half of the year. However, the chip’s competitive edge is likely to erode as 2nm processors become more widely available later in the year. [Jiwei, in Chinese]
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