On July 28, TSMC inaugurated its new global R&D center in Hsinchu, Taiwan, with Chairman Mark Liu announcing that the new center aims to explore cutting-edge chip technologies below 2 nm or even 1.4 nm process in the next 20 years. TSMC CEO CC Wei also attended the inauguration ceremony, declaring TSMC’s determination to keep developing its major products and advanced technologies in Taiwan, even as the company expands its business overseas in recent years. The R&D Center covers an area of 300,000 square meters, which equals 42 standard football fields. Designed with a solar panel roof, the new building can generate 287 kilowatts of electricity at peak conditions, showcasing the company’s commitment to sustainable development. Currently, it is expected to relocate over 7,000 R&D employees by this September. [Economic Daily News, in Chinese]
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