Intel has defined, in his event Foundry Direct Connect 2025their priorities in process technology and for chips manufacturing. The company has brought together its partners and customers to show them the latest advances that it has achieved in several generations of its central process, as well as in packaging technologies.
In addition, he has announced new programs and associations of ecosystems, and has discussed representatives of the sector how a systems melting approach allows collaboration with partners and activates innovation for customers.
The person inaugurated the event has been Lip-bu tan, CEO of Intelwith an intervention in which he has talked about Intel Foundry’s progress and priorities as the company enters the next phase of its foundry strategy. Both as as Kevin O’Buckley, Director general de Foundry Serviceshave also offered details and news about advanced processes and packaging, apart from highlighting the global diversity of the company’s manufacturing and supply chain.
According to Lip-Bu Tan, «Intel has pledged to build a world category smelting that meets the growing need for avant -garde, packaging and manufacturing process technology advanced. Our number one priority is to listen to our clients and win their trust by creating solutions that allow their success. The work we are doing to promote a culture in which engineering is the first thing in all Intel, while reinforcing our associations throughout the foundry ecosystem, will help us advance our strategy, improve our execution and win in the long -term market«.
In addition to Intel Foundry managers, during the intervention of Tan in the event, several partners’ representatives of the company have accompanied the CEO of Intel. Among them Synopsys, Cadence, Siemens EDA and PDF Solutions. O’Buckley has not been only, since they have accompanied him executives of MediaTak, Microsoft and Qualcomm.
Intel Foundry news in process technology
The ads that Foundry has made at the event covers the central process and advanced packaging technology. Among them is the commitment to various clients of the use of the Intel 14A process technologyIntel 18a successor. The company has already distributed to its main clients a first version of the Intel 14A process design kit, and several have already expressed their intention to manufacture test chips using the new process node.
Intel 14A will incorporate PowerDirect’s direct energy supply, based on energy supply technology by the Powervia rear of Intel 18A. This process is already in the risk production phase, and it is expected to reach volume manufacturing this year.
Foundry’s partners already have electronic design automation tools (EDA), reference flows and intellectual property (IP) for production designs. As for the new Intel 18A variant, known as Intel 18A-P, is designed to offer more performance to more Foundry customers.
The first wafers based on this variant are already in the factory, and since the variant will be compatible with the Intel 18A design rules, IP and EDA partners have already begun to update their offers for it.
Another new Intel 18A variant, the 18A-PT, is based on the advances in performance and energy efficiency of Intel 18A-PT. It can be connected to the upper chip through 3D direct foveros with an interconnection step of hybrid binding less than 5 micrometers.
In addition, the first production of 16 nanometers in Intel Foundry is already in the factory, and the company is working with several clients in a 12 nanometers and derivative node, created in collaboration with UMC.
Advanced packaging and news in the partners ecosystem
Foundry offers integration at the system level with Intel 14A in Intel 18A-P, connected through Foveros Direct by 3D stacking, Multi-Die integrated interconnection bridge and hybrid binding interconnection technologies.
Among the new advanced packaging technologies is EMIB-T, prepared to address future memory needs of great bandwidth. Also two new additions to the architecture Foveros: Foveros-R and Foveros-B.
In addition, Foundry has reached a new commitment to Amkor Technology, which increases customer flexibility to choose more appropriate advanced encapsulated technology for him. On the other hand, Intel has added new programs at the Accelerator Alliance: Foundry Chiplet Alliance y Value Chain Alliance.
