TSMC will begin mass production of manufacturing technology in 2 Nm in the fourth quarter of 2025. A great advance in chips manufacturingalmost at the limit of the possible with the current silicon materials.
Advances in technological manufacturing processes are key in chip production and therefore throughout the technology industry. For better or worse. We have a failed change at the 10 Nm of Intel that was the beginning of the problems that have led to the current serious situation. On the other hand, TSMC, the first world Foundrie in number of customers, income, production capacity and technological level, He has not stopped advancing in the last decadebeing the first to access 7, 5 and 3 nanometers. In fact, an Intel alliance with TSMC was rumored.
The 2 nm of TSMC, underway
Some of the great world technology will change to the TSMC 2 NM technology in 2026, and to help facilitate this transition, the semiconductor giant, intends to start mass production in the fourth quarter of 2025.
Repeating the jump of previous processes, sources of the production channel in Taiwan indicate that Apple will be the biggest client for these wafersensuring almost half of the initial capacity. The firm of Cupertino will use it in the A20 and A20 PRO that are expected for the iPhone 18 series. Qualcomm will be the second that receives the most orders, while other customers, such as AMD, MediaTak or Broadcom will have to wait more to achieve avant -garde technology.
Facing 2026, the volume of the six main clients mentioned will be triggered. In 2027, in addition to NVIDIA, among customers who will enter into mass production, more than 10 large manufacturers are included, such as Annapurna, under the control of Amazon, and Google.
TSMC intends to achieve an initial production capacity at 2 Nm from 45,000 to 50,000 monthly wafers, with an estimated cost of $ 30,000 per unit. A significantly higher Price than previous process technologies. As for performance, it is expected to exceed 60% achieved during the test phase.
Most of the 2 Nm wafering production will be carried out in TSMC plants in Baoshan and Kaohsiung. By the end of next year, it is estimated that the semiconductor giant will reach 100,000 monthly wafers, and it is expected that the commissioning of its Arizona manufacturing plant, in the US, increases that figure to 200,000 monthly units for 2028.
It is believed that the price increase of the most advanced TSMC wafers will force its customers to transfer this increase in costs to their products, which could negatively affect demand. Like not all customers still need the 2 NM and with the aim of facing external challenges such as tariffs, exchange and cost fluctuations, TSMC will maintain mass production 5, 4 and 3 nm for many years. In addition, production will increase in all its nodes due to the great demand for semiconductors for ia.