Asus has announced a range of Optimized liquid cooling solutions for high-density computing infrastructuresdesigned to address the temperature, power, and density challenges of next-generation high-performance computing and AI data centers.
Designed to provide cooling solutions for ultra-high-density infrastructure, the solutions provide the critical thermal management needed for data centers based on the next-generation NVIDIA Vera Rubin NLV72 system.
By efficiently dissipating heat from CPUs, GPUs and racks with a high concentration of accelerators, Asus systems reduce power consumption, reduce PUE and optimize TCO, in addition to supporting high levels of per-rack density.
These solutions include direct-to-chip (D2C) cooling systems, in-row CDU solutions and hybrid configurations, developed in collaboration with Schneider Electric and Vertiv and with precision components from Auras Technology and Cooler Master, among others. This ecosystem allows Asus to offer custom-designed turnkey solutions, ensuring operational stability and improving efficiency and scalability.
One of the ecosystems in which an Asus liquid cooling system has been deployed recently is the National Center for High Performance Computing, of the National Institutes of Applied Research in Taiwan. This system integrates a dual computing architecture, which includes the NVIDIA HGX 200 Nano 4 cluster and the NVIDIA GB200 NVL72.
This is Taiwan’s first deployment of a fully liquid-cooled AI supercomputer featuring this architecture, and showcases Asus’ ability to integrate high performance, sustainability and advanced thermal management into AI infrastructures. Completely designed and developed by Asus, The system implements direct liquid cooling (DLC) technology to achieve a high level of energy efficiency: 1,18.
