Two Chinese chip-makers, ChangXin Memory Technologies (CXMT) and Wuhan Xinxin, are at the early stages of producing high bandwidth memory (HBM) semiconductors essential for artificial intelligence chipsets, according to a report by Reuters published on Wednesday. China’s leading DRAM (Dynamic Random-Access Memory) manufacturer CXMT has partnered with chip packaging and testing company Tongfu Microelectronics to develop sample HBM chips and has showcased them to clients, Reuters said, citing sources familiar with the matter. Documents from the corporate database Qichacha indicate that Wuhan Xinxin began constructing a factory in February of this year, which is intended to have the capacity to produce 3,000 12-inch HBM wafers per month. CXMT and other Chinese chip firms have also been meeting with semiconductor equipment firms from South Korea and Japan to purchase tools for the development of HBM, sources added. [Reuters]
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