As anticipation builds around the launch of Google’s next-generation smartphone, the Pixel 10, leaks and speculations are beginning to intensify. The Pixel 10 is reportedly set to launch on August 13 and is supposed to introduce performance, camera technology and design improvements in a meaningful way. Google has been highly secretive with regard to the actual details but a recent development has offered an unexpected glimpse into the device through a listing on a Chinese auction platform.
Prototype Surfaces on Chinese Auction Site
On a Chinese reselling site ( Xianyu ) a seller put up what is claimed to be a Pixel 10 prototype motherboard, allegedly taken out of an Engineering Validation Testing (EVT) unit. This is a part of the product development that usually takes place just as a device is about to be put into mass production. The listing also featured images of the prototype device, which showcases Google’s familiar design language including flat edges, rounded corners, and the iconic horizontal camera bar on the back.
One of the key takeaways from the leaked images is the presence of a triple-lens rear camera setup. This implies that Google may attach a telephoto sensor to the Pixel 10 to offer an upgrade over the Pixel 9’s dual-camera system.
Tensor G5 Chip: Samsung or TSMC?
What’s generating even more discussion is the prototype’s motherboard, labeled with “Tensor G5” and marked SEC, which typically denotes Samsung Electronics. This raises questions about Google’s chip supplier. Earlier reports strongly suggested that Google would move Tensor chip production to TSMC starting with the G5, making this Samsung marking somewhat surprising.
It’s unclear whether this prototype reflects an early production plan that has since changed or if Samsung remains involved in the chip’s development. The auction listing didn’t offer any technical confirmation and mainly focused on avoiding scams.
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