TSMC A14 is the new semiconductor manufacturing node That the company has just presented in its technology symposium, the beginning of some events that it celebrates annually in several points of the planet where it informs its customers about its latest technological advances, offers its startups an “innovation zone” and presents its solutions to potential investors.
The manufacturing processes have become a central point of world technology and advances have become especially in the last decade. But it is increasingly complicated to improve them. The exponential increase in reduction of the size and cost of semiconductors ended long ago and with it Moore’s law that has decisively influenced modern computing.
TSMC A14, looking for the limits of silicon
TSMC is the most important Foundrie in the world for income and customers, and can boast the most advanced technologies. The company promises “Significant advances” With respect to the N2 process that will enter mass production this year with prominence for its 2 nanometers. No one can surprise that in the middle of the artificial intelligence, the company says that “It is designed to promote the transformation of AI”.
Compared to the N2 process, the TSMC A14 will offer up to 15 % of improvement in speed with the same power, or up to 30 % power reduction with the same speed, together with an increase of more than 20 % in the logical density. Taking advantage of the company’s experience in the joint optimization of design and technology for nanolminas transistors, Foundrie is evolving its standard cell architecture Nanoflex to Nanoflex Pro, which allows a higher performance, energy efficiency and design flexibility.
In addition to the A14, TSMC also presented new logic, specialty, advanced packaging and 3D chip stacking, each of which contributes to broad technological platforms in high performance computer science (HPC), smartphones, automotive and internet of things (IoT). These offers are designed to provide customers with a complete set of interconnected technologies that promote the innovation of their products.
Among them, the one dedicated to high performance computer science, improving its technology Chip about wafer about substrate (Cowos) to address the insatiable need for the AI of more logic and high band memory (HBM). The company plans to carry cowos with a 9.5 grid size to volume production in 2027, which will allow the integration of 12 HBM batteries or more in a package along with the VSMC avant -garde logical technology.
TSMC A14 has an entry into Production planned for 2028. Although concrete details have not been facilitated on the process node, the 2 nanometers of the N2 are expected to reduce.
