On Wednesday, TSMC unveiled its A16 (1.6nm) technology for the first time at the 2024 North America Technology Symposium in California, with the Taiwan-based chip foundry announcing plans to begin mass-production with the new manufacturing process in 2026. TSMC claimed that its A16 technology will boost logic density and chip performance by combining advanced nanosheet transistors with backside power rail solutions. Compared to the N2P process, A16 offers an 8-10% increase in speed at the same operating voltage, a 15-20% reduction in power consumption at the same speed, and a density improvement of up to 1.1 times to support data center products, according to the company. [Economic Daily News, in Chinese]
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