TSMC’s advanced packaging capacity fully booked for the next two years · TechNode

Nvidia and AMD have secured TSMC’s advanced packaging capacity for Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Integrated-Chip (SoIC) technologies for the next two years as they focus on the high-performance computing (HPC) market, according to Taiwanese media outlet Economic Daily News. HPC’s computational power is essential for AI tasks, with TSMC expecting revenue from AI processors to more than double this year. TSMC predicts that the compound annual growth rate of AI chips over the next five years will reach 50%, accounting for over 20% of the chip foundry’s revenue by 2028. Global cloud service providers Amazon AWS, Microsoft, Google, and Meta are actively engaging in the AI server race, leading to a high demand for products from AI chip manufacturers such as Nvidia and AMD, the report said. [Economic Daily News, in Chinese]

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