United Microelectronics Corporation (UMC), a major player in semiconductor wafer foundry, has secured a significant order from Apple’s radio frequency power amplifier supplier Qorvo, as reported by Taiwanese media outlet Economic Daily News. Qorvo will integrate new chips with its power amplifiers for antenna components of the next generation of iPhones, with the new chips manufactured using UMC’s 3DIC (three-dimensional integrated circuit) technology. Supply chain sources disclosed that Apple has revised the design of the antenna module for the next generation of iPhones to bolster signal performance. This optimization includes the integration of products from Anokiwave, a company recently acquired by Qorvo, aimed at enhancing the iPhone’s signal reception capability. [Economic Daily News, in Chinese]
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