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Reading: MWC 2026: Tecno unveils ultra-slim modular magnetic concept phone, swappable components in minutes · TechNode
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World of Software > Computing > MWC 2026: Tecno unveils ultra-slim modular magnetic concept phone, swappable components in minutes · TechNode
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MWC 2026: Tecno unveils ultra-slim modular magnetic concept phone, swappable components in minutes · TechNode

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Last updated: 2026/03/02 at 9:34 PM
News Room Published 2 March 2026
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MWC 2026: Tecno unveils ultra-slim modular magnetic concept phone, swappable components in minutes · TechNode
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Tecno, a subsidiary of Transsion, unveiled an ultra-thin modular magnetic concept smartphone at MWC, aiming to challenge the fixed-hardware model of today’s devices. The concept is built on a simple premise: conventional smartphones lock users into a single hardware configuration, requiring a full device upgrade to access new features. This new system instead allows users to attach or swap modules on demand, with changes completed in minutes.

At just 4.9mm thick, the prototype features a matte glass finish and a rectangular magnetic array. Power is delivered through pogo-pin connectors, while data transmission is supported via Bluetooth, Wi-Fi and millimeter-wave connectivity. Users can plug in modules such as snap-on power banks, camera lenses and gaming grips.

Still at the prototype stage, the technology could, if commercialized, see Transsion open its standards to third parties to foster a broader modular ecosystem. [TechNode Reporting]

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