South Korean memory chip giant SK Hynix will produce sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process for key clients in the second half of 2025, The Korea Economic Daily reported on Tuesday. Sources indicate that SK Hynix will partner with TSMC to release a prototype of vertically stacked HBM4 chips with a base die manufactured using TSMC’s 3nm process as early as March next year. NVIDIA will be the primary customer for the shipments. A base die refers to the foundational layer in a multi-layer semiconductor package, particularly in advanced memory chips such as HBM. Having HBM stacked on a 3nm base die is expected to boost performance by 20-30% compared to HBM4 with a 5nm base die, the report added. [The Korea Economic Daily]
Related
