There are times when professional computing stop talking in gigahertz to do it in deeper terms: in parallel memory lines, bandwidths that challenge traditional buses or cores that no longer work alone, but in a coalition of pure silicon. It is not a question of power in itself, but of purpose: to build tools capable of facing the vertigo of modern calculation, from fluid mechanics to the most complex generative models. In that area where hardware stops being a means and becomes the very limit of what is possible, the new Xeon 600 emerge.
Intel has finally unveiled this long-awaited series of processors for workstations, consolidating its vision of “Heavy-Duty Computing” as the structural basis of its professional platform by 2026. The Xeon 600 not only replace previous generations, but redefine the technical profile of the modern workstation: more than an evolution, it is an architectural renovation that addresses both intensive computing and workflows of artificial intelligence, simulation and rendering, all within a monolithic platform that prioritizes performance, scalability and efficiency.
At its most literal core, this family of processors reaches up to 86 P (performance) cores per socket, under the new LGA 4710-2with full support for DDR5 and PCIe 5.0. The thermal structure has been optimized to maintain these processing levels without increasing consumption, while the Intel W890 chipset becomes the new epicenter of the professional enthusiast range. But if there is a component that defines the generational leap of the Xeon 600, it is memory.
For the first time in the workstation sector, Intel introduces MRDIMM (Multiplexed Rank DIMM) supportan evolution on DDR5 that allows reaching vspeeds up to 8000 MT/seffectively doubling the available bandwidth compared to traditional DIMMs. This advance is crucial in scenarios where the CPU is not the bottleneck, but the access to data in memory: big data analysis, multiple event simulation or highly parallelizable loads. Additionally, the platform supports up to 4TB of RAM and features 128 PCIe 5.0 lanes, with support for CXL 2.0, making these motherboards true expansion centers.
In the field of AI, the Xeon 600 have been optimized to cover the entire work spectrum: from data preparation to training and inference. Each core integrates Intel AMX (Advanced Matrix Extensions) with native support for FP16, Bfloat16 and Int8, enabling tensor operations directly on the CPU. For those who need to scale beyond a single processor, support for up to 8 PCIe 5.0 GPUs is contemplated, creating hybrid CPU-GPU systems with tools such as Intel OpenVINO and oneAPI, which allow the workload to be distributed based on the most efficient architecture.
The first benchmarks released reinforce the generational leap. The Xeon 698X model, flagship of this series, achieves Up to 61% more multithread performance compared to the Xeon w9-3595Xand 9% more in single-wire loads. In real applications, the increase translates to +74% in rendering with Blender, +30% in CFD simulation using OpenFOAM, and a similar improvement in structural analysis with MFEM. Photorealistic visualization in Dassault Steller shows a 29% jump, while in hardware upscaling and denoising tasks, similar improvements are seen taking advantage of AMX instructions.
One of the most notable surprises has been the introduction of Extreme overclocking capabilities on multiple unlocked (“X”) SKUs. These models allow modify ratios for AVX-512 and TMULadjust the interconnection mesh by die and even perform controlled undervoltage, something unheard of in the workstation world. To facilitate this customization, Intel has signed a partnership with OCBASE, adding advanced support to the OCCT tool, including telemetry, stability testing, and compatibility with Linux and Windows. In fact, the 698X has already achieved global records in tests such as Cinebench R23, Y-Cruncher and Geekbench.
Below, we leave you the complete list of Xeon 600 processors announced for workstations, with their key technical specifications:
| SKU | Núcleos P | Turbo Max (GHz) | Turbo todos (GHz) | Base (GHz) | Hidden L3 (MB) | TDP (W) | Canales Mem. | MRDIMM (MT/s) | vPro | Precio (USD) |
|---|---|---|---|---|---|---|---|---|---|---|
| 698X | 86 | 4,8 | 3,0 | 2,0 | 336 | 350 | 8 | 8.000 | Yeah | 7.699,00$ |
| 696X | 64 | 4,8 | 3,5 | 2,4 | 336 | 350 | 8 | 8.000 | Yeah | 5.599,00$ |
| 678X | 48 | 4,9 | 3,8 | 2,4 | 192 | 300 | 8 | 8.000 | Yeah | 3.749,00$ |
| 676X | 32 | 4,9 | 4,3 | 2,8 | 144 | 275 | 8 | 8.000 | Yeah | 2.499,00$ |
| 674X | 28 | 4,9 | 4,3 | 3,0 | 144 | 270 | 8 | 8.000 | Yeah | 2.199,00$ |
| 658X | 24 | 4,9 | 4,3 | 3,0 | 144 | 250 | 8 | N/D | Yeah | 1.699,00$ |
| 656 | 20 | 4,8 | 4,5 | 2,9 | 72 | 210 | 8 | N/D | Yeah | 1.399,00$ |
| 654 | 18 | 4,8 | 4,5 | 3,1 | 72 | 200 | 8 | N/D | Yeah | 1.199,00$ |
| 638 | 16 | 4,8 | 4,5 | 3,2 | 72 | 180 | 4 | N/D | Yeah | 899,00$ |
| 636 | 12 | 4,7 | 4,5 | 3,5 | 48 | 170 | 4 | N/D | Yeah | 639,00$ |
| 634 | 12 | 4,6 | 3,9 | 2,7 | 48 | 150 | 4 | N/D | Yeah | 499,00$ |
The versions retail (Boxed) will be available for models 696X, 678X, 676X, 658X y 654all of them prepared for new generation thermal solutions compatible with LGA 4710-2. The complete range is thus positioned as the most extensive and versatile offering ever launched by Intel in the workstation segment.
The range includes models from 12 to 86 cores, with base frequencies between 2.0 and 3.5 GHz, and TDPs ranging between 150 and 350 W. Official prices range from $499 for the Xeon 634 to $7,699 for the 698X, all with support for Intel vPro®, Total Memory Encryption and remote management. Retail versions will be offered in at least five unlocked configurations, with heatsinks compatible with the new socket already on the market.
Although the focus of this launch is clearly on the high-end desktop, Intel has taken the opportunity to draw the guidelines of its workstation ecosystem for 2026. Below the Xeon 600 we find the continuity of the W-3500 and W-2500 series, and for lighter desktop workstations, the new Intel Core Ultra 200 Desktop with W880 chipsets debuts. The portable field will be divided between the Core Ultra 200HX series, aimed at raw performance, and a new Series 3 designed for ultra-thin mobile stations, both with integrated Intel Arc Pro graphics.
This panorama is completed with a clear strategy: offer a workstation for every needfrom the scientist who trains AI models with millions of parameters to the designer who needs thermal precision in laptops weighing less than two kilos. All the major manufacturers—Dell, HP, Lenovo, ASUS, Supermicro—have confirmed support for the new boards and sockets.
As the professional market prepares to receive this new generation starting in March 2026, one thing is clear: the hardware no longer only responds to the demands of the present, it also anticipates the demands of the future. I find it fascinating to see how Intel has shaped a family of processors that is not only measured in cores or gigahertz, but in possibilities. With the Xeon 600, the workstation is no longer just a tool: it is the laboratory where what is to come is designed.
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