The most striking novelty of the Dimensity 9500 is its architecture: it abandons the traditional “economical” cores to focus on eight high performance cores. We thus find an Arm C1-UNTRA heart clocked at 4.21 GHz, three C1-Premiums at 3.5 GHz and four C1-PROS at 2.7 GHz. Result, Mediatek announces a leap of 32 % in monocor performance and an improved efficiency of 55 % compared to the Dimensity 9400. In multicœur, the progress is more modest: +13 % in speed and +37 % in efficiency. A big speed bump, in short.
Only efficient hearts
Storage is also in the spotlight with UFS 4.1 compatibility with four lines, which allows faster transfers and optimized management of large AI models, at least on paper. The manufacturer ensures that the multitasking will be 30 % more economical, even when playing while using an application as a discord.
On the fluidity side, Mediatek promises a launch of applications in just 42 ms, a scrolling ” slim And the possibility of opening up to 20 apps simultaneously. So many arguments intended to seduce the most demanding users.
The graphic part is based on a Mali G1-Ultra GPU, with a 33 % gain in advanced performance and 42 % in efficiency. The emphasis is on Raytracing ” console », With an execution at 120 fps and realistic light effects.
But it is on the AI that Mediatek insists the most. Its new NPU 990 inaugurates Compute in Memory technology, supposed to allow continuous operation of AI models directly on the smartphone. Concretely, the generation of tokens would be twice as fast, the creation of 4K images possible locally, and the energy consumption reduced by half. Enough to speed up AI apps and models like Gemini, directly on the device.
In photo and video, the Dimensity 9500 supports shots of up to 200 megapixels, the Dolby Vision recording in 4K at 120 I/s, and 4K60 portrait videos with electronic stabilization. Connectivity is not to be outdone: 5G, Wi-Fi 7 Tri-Bande up to 7.3 Gbit/s, Bluetooth 6.0 and GPS improved by AI are on the program.
Mediatek recalls that its high -end dimensity flea sales have jumped 350 % since 2022, a sign of the growing interest of industry for these chips. The 9500 will first be integrated into smartphones like Vivo or Oppo, which could also be launched in Europe.
Finally, the company has confirmed to work already on its future SOC Dimensity 9600, which will operate the N2P engraving of TSMC from 2026. This 2 NM technology should offer 18 % additional performance and 36 % of efficiency gains. TSMC has already enlisted about fifteen customers for its N2 process, including Apple, AMD and Intel.
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