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World of Software > News > This Could Be The Ultimate Tiny PC
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This Could Be The Ultimate Tiny PC

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Last updated: 2025/09/29 at 11:46 PM
News Room Published 29 September 2025
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Summary

  • Qualcomm’s Snapdragon X2 mini-PC prototypes deliver desktop power in coaster-sized and modular forms.
  • AirJet solid-state cooling uses ultrasonic vibrating membranes to cool tiny fanless PCs quietly.
  • Snapdragon X2 benchmarks rival top chips – tiny ARM PCs could match desktop performance if produced.

We’ve seen a whole lot of tiny PCs in all shapes, forms, and specs. We like them a lot here at How-To Geek. But Qualcomm’s prototype computers have us wishing that we could actually have them as a real product.

At its event, Qualcomm showed off a couple of mini PC prototypes powered by the new Snapdragon X2 Elite and the X2 Extreme. And they look pretty cool. The first prototype has a slim, circular form factor, more reminiscent of a network appliance or a coffee coaster than a computer. According to reports from journalists who viewed the device, the unit is roughly half an inch thick and features a glowing Qualcomm logo on its top surface. And despite its minimal size, it is a fully functional desktop, equipped with USB-C ports for power, video output, and data transfer, with vents on its underside for cooling.

The second prototype presents a modular approach, appearing as a small, square unit with rounded corners, similar in size to a portable optical drive. This device is designed to serve as the computing core for an all-in-one desktop, drawing power from the stand while delivering video to the display.

To achieve the thinness they have, some unconventional methods were required. Sure, the fact it’s an ARM chip does wonders, but there’s more to it. To manage this in such a compact chassis where a traditional fan would not fit, Qualcomm has integrated Frore’s AirJet cooling system. It’s a solid-state active cooling solution, which utilizes tiny, vibrating membranes that move air at ultrasonic frequencies. This allows for active heat dissipation in a much smaller package and with less noise than a conventional fan. While AirJet technology has been available for several years, its adoption has been slow, likely due to cost and power consumption concerns. The few times I’ve seen it, though, it’s always really cool.

Snapdragon X2 chips apparently excel in benchmarks like GeekBench, Cinebench, and 3DMark, often ranking among the fastest processors available. So if this actually became a real product, it could be a powerful, and tiny, computer that was actually as light as a phone could get. It’s not a particularly hard endeavor, but now I wish someone would actually make this—because Qualcomm probably won’t.

Source: Liliputing

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