TSMC will receive its first ASML’s most advanced High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography machine by the end of 2024, according to Japanese media outlet Nikkei Asia. Each High NA EUV machine costs over $350 million and will enable semiconductor makers to produce smaller chips. Although High NA EUV offers finer resolution than the current standard EUV, chip manufacturers still need to make further design adjustments to produce more advanced chips. Major semiconductor manufacturing companies are investing significant funds to develop advanced packaging technologies, aiming to integrate more chips into the packaging to further enhance chip performance. TSMC’s rival Samsung will install its first High NA EUV lithography machine in the first quarter of 2025, sources said. [Nikkei Asia]
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